抛光

• 来源期刊: 金属加工工艺与设备：英文版
• 学科: 工学
• 关键词: 抛光工艺 热氧化 弱分子键 CMP 纳米轨道
• 年，卷（期）: 2005,（1）
• 页码范围: 8-10
• 页数: 3页
• 分类号: TG580.692

摘要

A mathematical model for chemical-mechanical polishing based on formation and removal of weakly bonded molecular species,A Model of Chemical Mechanical Polishing: The Role of Inhibitors,A Nanochannel Fabrication Technique Using Chemical-Mechanical Polishing (CMP) and Thermal Oxidation,A new method for preparing powders for transmission electron microscopy examination,A New Paradigm of Using TEM in Yield Enhancement Failure Analysis for Sub-Micron Integrated Circuit Devices.