磨粒

• 来源期刊: 金属加工工艺与设备：英文版
• 学科: 工学
• 关键词: 材料移动率 磨粒工艺 金属加工 化学抛光 CMP
• 年，卷（期）: 2005,（1）
• 页码范围: 38-40
• 页数: 3页
• 分类号: TG175

摘要

Modelling the entrainment and motion of particles in a gap: application to abrasive wear, Multi-Scale Characterization of Pad Role on Material Removal Rate in CMP, Multiscale material removal modeling of chemical mechanical polishing,Multiscale mechanical modeling of CMP, Simulation of organic coating removal by particle impact,The effect of cutting jet variation on surface striation formation in abrasive water jet cutting.