研磨

• 来源期刊: 金属加工工艺与设备：英文版
• 学科: 工学
• 关键词: 研磨机械 过水作用 硅水偏振 测量方法
• 年，卷（期）: 2005,（2）
• 页码范围: 8-9
• 页数: 2页
• 分类号: TG591

摘要

High aspect ratio through-wafer interconnections for SD-microsystems;Kinematics and application of simultaneous double-disk grinding in silicon wafer planarization;Measurement of subsurface damage in silicon wafers ;New processes to prevent a flow defect in the combined forward-backward cold extrusion of a piston-pin