Dow Corning~ Materials for Printed Electronics

• 来源期刊: 射频世界
• 学科: 工学
• 年，卷（期）: 2007,（1）
• 页码范围: 92-93
• 页数: 2页
• 分类号: TP391.44

摘要

A new generation of RFID materials with de- signed-in compatibility helps raise quality, reliability and process efficiency If RFID technology is headed for the heights predicted by forecasters, it will require an ongoing evolution of new materials and re- lated technologies to help reduce card/label assembly costs and improve performance. From a materials standpoint, the critical elements in any printed RFID inlay include the chip, the chip attachment method, the antenna,