Micro thermal shear stress sensor based on vacuum anodic bonding and bulk-micromachining

• 来源期刊: 中国物理B(英文版)
• 关键词: thermal micro shear stress sensor vacuum anodic bonding bulk-micromachined
• 年，卷（期）: 2008,（6）
• 页码范围: 2130-2136
• 页数: 7页
• 语种: 英文

摘要

This paper describes a micro thermal shear stress sensor with a cavity underneath, based on vacuum anodic bonding and bulk micromachined technology. A Ti/Pt alloy strip, 2μmx100μm, is deposited on the top of a thin silicon nitride diaphragm and functioned as the thermal sensor element. By using vacuum anodic bonding and bulk-si anisotropic wet etching process instead of the sacrificial-layer technique, a cavity, functioned as the adiabatic vacuum chamber, 200μm×200μm×400μm, is placed between the silicon nitride diaphragm and glass (Corning 7740). This method totally avoid adhesion problem which is a major issue of the sacrificial-layer technique.