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摘要:
Organic Light-Emitting diodes (OLEDs) are extremely sensitive to water vapour and oxygen, which causes rapid degradation. Epoxy and cover glass with large amount of desiccant are commonly applied to encapsulate bottom emitting OLEDs which is not a viable option for flexible as well as top emitting OLEDs. This paper reports a completely organic encapsulating layer consisting of four periods of alternate stacks of two organic materials with different morphologies deposited by simple vacuum thermal evaporation technique. Standard green OLED structures with and without encapsulation were fabricated and investigated using structural, optical and electrical studies. Moreover, the encapsulation presented being organic is safe for underlying organic layers in OLEDs and is ultrathin, transparent and without any cover glass and desiccant, ensuring its application in flexible and top emitting OLEDs.
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篇名 New Organic Thin-Film Encapsulation for Organic Light Emitting Diodes
来源期刊 封装与吸附期刊(英文) 学科 化学
关键词 OLED THIN Film ENCAPSULATION DIFFUSION BARRIER ATOMIC Force MICROSCOPY
年,卷(期) 2011,(2) 所属期刊栏目
研究方向 页码范围 23-28
页数 6页 分类号 O6
字数 语种
DOI
五维指标
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研究主题发展历程
节点文献
OLED
THIN
Film
ENCAPSULATION
DIFFUSION
BARRIER
ATOMIC
Force
MICROSCOPY
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研究来源
研究分支
研究去脉
引文网络交叉学科
相关学者/机构
期刊影响力
封装与吸附期刊(英文)
季刊
2161-4865
武汉市江夏区汤逊湖北路38号光谷总部空间
出版文献量(篇)
103
总下载数(次)
0
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0
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