A spatiotemporal signal processing technique for wafer-scale IC thermomechanical stress monitoring by an infrared camera

• 作者: Ahmed Lakhssassi Emmanuel Kengne Michel Saydé Roman Palenichka
• 来源期刊: 生物科学与医学(英文)
• 学科: 医学
• 关键词: THERMAL Monitoring Ring Oscillator (RO) Spatial SPATIOTEMPORAL THERMO-MECHANICAL Stress Temperature Sensor THERMAL Analysis WaferIC Wafer-Scale System
• 年，卷（期）: swkxyyxyw,（2）
• 页码范围: 1-5
• 页数: 5页
• 分类号: R73

摘要

In this paper, we describe a new silicon-die thermal monitoring approach using spatiotemporal signal processing technique for Wafer-Scale IC thermome- chanical stress monitoring. It is proposed in the context of a wafer-scale-based (WaferICTM) rapid prototyping platform for electronic systems. This technique will be embedded into the structure of the WaferIC, and will be used as a preventive measure to protect the wafer from possible damages that can be caused by excessive thermomechanical stress. The paper also presents spatial and spatiotemporal algorithms and the experimental results from an IR images collection campaign conducted using an IR camera.