Dendritic Growth, Eutectic Features and Their Effects on Hardness of a Ternary Sn-Zn-Cu Solder Alloy

• 来源期刊: 金属学报（英文版）
• 年，卷（期）: 2017,（6）
• 页码范围: 528-540
• 页数: 13页
• 语种: 英文
• DOI: 10.1007/s40195-017-0572-9

摘要

The present investigation is based on the results of a directionally solidified (DS) Sn-9 wt％Zn-2 wt％Cu alloy,including primary/secondary/tertiary dendrite arm spacings of the Sn-rich matrix,the morphologies of the eutectic mixture and the corresponding interphase spacing,the nature and proportion of the Cu-Zn intermetallic compound (IMC).The main purpose is to establish interrelations of these microstructure features with experimental solidification thermal parameters,such as cooling rates and growth rates (v),macrosegregation and hardness.Such interrelations are interesting for both industry and academy since they represent a tool permitting the preprogramming of final properties based on the design of the microstructure.In the case of Sn-Zn-Cu alloys,hardly anything is known about the combined effects of the length scale of the microstructure and fraction and distribution of the primary IMC on hardness.The alloy microstructure is composed of a β-Sn dendritic region,surrounded by a eutectic mixture of α-Zn and β-Sn phases and the γ-Cu5Zns IMC.The eutectic interphase spacing varies in the range 1.2-3.6 μm,with the α-Zn phase having a globular morphology for v ＞ 0.5 mm/s and a needle-like morphology for v ＜ 0.3 mm/s.A modified Hall-Petch-type experimental expression relating hardness to the interphase spacing is proposed.