Evolution of microstructure and texture in copper during repetitive extrusion-upsetting and subsequent annealing

• 来源期刊: 材料科学技术（英文版）
• 年，卷（期）: 2017,（7）
• 页码范围: 690-697
• 页数: 8页
• 语种: 英文

摘要

The evolution of the microstructure and texture in copper has been studied during repetitive extrusionupsetting (REU) to a total von Mises strain of 4.7 and during subsequent annealing at different temperatures.It is found that the texture is significantly altered by each deformation pass.A duplex <001> + <111> fiber texture with an increased <111> component is observed after each extrusion pass,whereas the <110> fiber component dominates the texture after each upsetting pass.During REU,the microstructure is refined by deformation-induced boundaries.The average cell size after a total strain of 4.7 is measured to be ～0.3 μm.This refined microstructure is unstable at room temperature as is evident from the presence of a small number of recrystallized grains in the deformed matrix.Pronounced recrystallization took place during annealing at 200 ℃ for 1 h with recrystallized grains developing predominantly in high misorientation regions.At 350 ℃ the microstructure is fully recrystallized with an average grain size of only 2.3 μm and a very weak crystallographic texture.This REU-processed and subsequently annealed material is considered to be potentially suitable for using as a material for sputtering targets.