Review of the Global Trend of Interconnect Reliability for Integrated Circuit

• 作者: Guoqing Jia Haifeng Wu Qian Lin
• 来源期刊: 电路与系统(英文)
• 学科: 工学
• 关键词: Integrated CIRCUIT INTERCONNECT RELIABILITY INTERCONNECT Modeling INTERCONNECT Process
• 年，卷（期）: 2018,（2）
• 页码范围: 9-21
• 页数: 13页
• 分类号: TN4

摘要

Interconnect reliability has been regarded as a discipline that must be seriously taken into account from the early design phase of integrated circuit (IC). In order to study the status and trend of the interconnect reliability, a comprehensive review of the published literatures is carried out. This can depict the global trend of ICs’ interconnect reliability and help the new entrants to understand the present situation of this area.