Enhancing the Creep Resistance of Sn-9.0Zn-0.5Al Lead-Free Solder Alloy by Small Additions of Sb Element

• 作者: A. B. El Basaty E. A. Eid Manal A. Ramadan
• 来源期刊: 工程(英文)(1947-3931)
• 学科: 工学
• 关键词: Sn-Zn-Al-Sb Alloys LEAD Free Solders SB ADDITION CREEP Properties
• 年，卷（期）: gc-eng_2018,（1）
• 页码范围: 21-34
• 页数: 14页
• 分类号: TG14

摘要

The creep phenomenon is considered as one of the most important deformation mechanisms under working conditions. The present study has examined the microstructure and creep properties of Sn-9.0Zn-0.5Al solder alloy after adding a small amount of Antimony (Sb). Nominal compositions of Sb additions were chosen to be 0, 0.5, 1.0, and 1.5 wt.%. The minimum strain rate was reduced for the Sb containing solder alloy. The stress exponents, n, were found to be around 3.7 for all soldiers at 130°C. The stress exponent increases as the temperature drops from 100°C to 50°C, except for the 1.0% Sb alloy, where n 5.3 - 6.1 at all the temperature range (T = 50°C, 100°C and 130°C). The results reveal that the Sb-containing solder alloys have better creep resistance with greater ductility than the Sb-free alloy due to solid solution strengthening, and intermetallic compound SnSb particle hardening.