Precise assembly and joining of silver nanowires in three dimensions for highly conductive composite structures

• 来源期刊: 极端制造(英文)
• 年，卷（期）: 2019,（2）
• 所属期刊栏目: MATERIAL INTERACTIONS WITH ENERGY BEAMS AND FIELDS
• 页码范围: 87-102
• 页数: 16页
• 语种: 中文

摘要

Three-dimensional (3D) electrically conductive micro/nanostructures are now a key component in a broad range of research and industry fields. In this work, a novel method is developed to realize metallic 3D micro/nanostructures with silver-thiol-acrylate composites via two-photon polymerization followed by femtosecond laser nanojoining. Complex 3D micro/nanoscale conductive structures have been successfully fabricated with～200 nm resolution. The loading of silver nanowires (AgNWs) and joining of junctions successfully enhance the electrical conductivity of the composites from insulating to 92.9 S m-1 at room temperature. Moreover, for the first time, a reversible switching to a higher conductivity is observed, up to～105 S m-1 at 523 K. The temperature-dependent conductivity of the composite is analyzed following the variable range hopping and thermal activation models.The nanomaterial assembly and joining method demonstrated in this study pave a way towards a wide range of device applications, including 3D electronics, sensors, memristors, micro/nanoelectromechanical systems, and biomedical devices, etc.