The Microstructure and Properties of Copper with Ceria Nanoparticles Addition

• 作者: Daniela Passarelo Moura da Fonseca Waldemar Alfredo Monteiro
• 来源期刊: 材料科学与化学工程(英文)
• 学科: 工学
• 关键词: COPPER-BASED Composites CERIA Microstructure Electrical CONDUCTIVITY HARDNESS
• 年，卷（期）: 2019,（10）
• 页码范围: 40-48
• 页数: 9页
• 分类号: TB3

摘要

Copper-based composites strengthened by ceria nanoparticles were processed by conventional powder metallurgy: mixing (30 min and 46 rpm), compaction (cold, uniaxial, 1080 MPa for 10 s) and sintering (800°C for 6 h in vacuum atmosphere of 10−5 torr). It was studied the microstructure (optical microscopy, scanning electron microscopy), X-ray diffraction with Rietveld refinement and some properties (electrical conductivity, Vickers hardness and fracture analysis) of the compositions 92 wt% Cu - 8 wt% CeO2 and 80 wt% Cu - 20 wt% CeO2. The results showed uniform phase distribution, low porosity and ceria disperse inside copper grain. In despite of properties, the composites had electrical conductivity of 38% IACS and 15% IACS and hardness of 69 and 88 HV5, respectively. The results of 92 wt% Cu - 8 wt% CeO2 composites were promising, and they are in according with actual literature.