Analysis of Transmission Characteristics of Copper/Carbon Nanotube Composite Through-Silicon Via Interconnects

• 作者: FU Kai HU Yue WANG Gaofeng ZHAO Wensheng ZHENG Jie
• 来源期刊: 中国电子杂志（英文版）
• 年，卷（期）: 2019,（5）
• 页码范围: 920-924
• 页数: 5页
• 语种: 英文
• DOI: 10.1049/cje.2019.06.005

摘要

We investigated the transmission characteristics of Cu/CNT composite Through-silicon via (TSV)interconnects.The equivalent lumped-element circuit model was established,with the effective conductivity employed for impedance extraction.The impacts of CNT filling ratio,temperature,and other geometrical parameters on the performance were examined.The sensitivity analysis of Cu/CNT composite TSVs was carried out.The electrical performance of Cu/CNT composite TSVs were optimized by utilizing low-permittivity dielectrics or even air-gap.