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摘要:
The quality of a via hole on a multilayer stack of Low Temperature Co-fired Ceramic (LTCC) tape is of utmost importance to its functionality. This paper investigates a substitute for the commonly used circular shape hole to a more complex one and its implications when different parameters such as sheet thickness, punch speed, travel distance and tool clearance are?changed. Fabrication of the punch tools and the punching process is carried out at the same machine, ensuring alignment. Two types of non-circular shape are chosen to carry out the experiment. Pre-sintered complex shape hole measurements show that while punch conditions such as speed and tool gap have?little effect on the size, sheet thickness and travel depth play a vital role in the overall dimension. Albeit having only a slight effect on the size, those parameters are significant in other aspects of hole quality. Post-sintering investigation is also observed and discussed.<
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篇名 Analysis on Micro Complex Shape Via Hole Punching on Low Temperature Co-Fired Ceramics
来源期刊 玻璃与陶瓷期刊(英文) 学科 工学
关键词 Low Temperature Co-Fired Ceramic Packaging NON-CIRCULAR VIA HOLES MICRO-HOLE PUNCHING
年,卷(期) 2020,(1) 所属期刊栏目
研究方向 页码范围 1-13
页数 13页 分类号 TQ1
字数 语种
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研究主题发展历程
节点文献
Low
Temperature
Co-Fired
Ceramic
Packaging
NON-CIRCULAR
VIA
HOLES
MICRO-HOLE
PUNCHING
研究起点
研究来源
研究分支
研究去脉
引文网络交叉学科
相关学者/机构
期刊影响力
玻璃与陶瓷期刊(英文)
季刊
2161-7554
武汉市江夏区汤逊湖北路38号光谷总部空间
出版文献量(篇)
103
总下载数(次)
0
总被引数(次)
0
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