Design of Millimeter-Wave Antenna-in-Package (AiP) for 5G NR

• 作者: CHANG Su-Wei HUANG Po-Chia HUNG Tzu-Chieh LIN Chueh-Jen TSAI Wen-Tsai
• 来源期刊: 中兴通讯技术（英文版）
• 年，卷（期）: 2020,（3）
• 页码范围: 26-32
• 页数: 7页
• 语种: 英文
• DOI: 10.12142/ZTECOM.202003005

摘要

For 5G new radio (NR), there are two frequency bands: Frequency Range 1 (FR-1) (low frequency) and Frequency Range 2 (FR-2) (millimeter-wave frequency). Millimeter-wave has been officially utilized in mobile applications. The wide bandwidth is the key for the milli-meter-wave band. However, higher loss has become the major challenge for the wide use of this frequency range. Antenna array and beamforming technologies have been introduced to resolve the path loss and coverage problems. The key design considerations of the beamform-ing antenna array are low loss, compact system and small size. Antenna-in-package (AiP) has become the most attractive technology for millimeter-wave front-end system. For the design of AiP, many parameters such as RF transition, material and heat need to be considered and de-signed properly. The Over-the-Air (OTA) testing technology is also very critical for AiP mass production. In this paper, the detail of AiP design and new OTA testing technology are dis-cussed and demonstrated.