Laser polymerized photonic wire bonds approach 1?Tbit/s data rates

• 作者: Saulius Juodkazis
• 来源期刊: 光：科学与应用（英文版）
• 年，卷（期）: 2020,（3）
• 所属期刊栏目: News and Views
• 页码范围: 483-484
• 页数: 2页
• 语种: 英文

摘要

Microelectronics has solved the challenge of packaging different functional elements with integrated chips (ICs) in modern computing and communication by wire bonding. Miniaturization was a trend guided by the requirements for faster, more portable and less expensive (smaller amount of materials) solutions, where wire bonding evolved to accommodate increasingly more complex 3D architectures of chips and printed circuit boards.