Advanced hermetic electronic packaging based on lightweight silicon/aluminum composite produced by powder metallurgy technique

• 作者: Yan-Qiang Liu Jian-Zhong Fan Xin-Xiang Hao Shao-Hua Wei Jun-Hui Nie Zi-Li Ma Ming-Kun Liu Ya-Bao Wang
• 来源期刊: 稀有金属（英文版）
• 年，卷（期）: 2020,（11）
• 所属期刊栏目: ORIGINAL ARTICLES
• 页码范围: 1307-1313
• 页数: 7页
• 语种: 英文
• DOI: 10.1007/s12598-016-0833-1

摘要

Silicon/aluminum(Si/Al)composite is a kind of lightweight electronic packaging material that received a lot of attention in the past 20 years.In this paper,a series of Si/Al composites with lowered coefficient of thermal expansion(CTE)and high thermal conductivity were produced by powder metallurgy(PM).The Si/Al com-posites are fully dense and have fine Si particles uniquely distributed within pure Al matrix.Three 50％Si/Al com-posites were designed to have strength in the range of 185-290 MPa to meet different demands,while the other properties keep invariable.Fracture toughness of the composites is measured to be 9-10 MPa·m1/2.The com-posites were machined to 50％Si/Al housings and 27％Si/Al lids.Both the hermeticities of housings before and after laser-beam-welding sealing are determined.The measured leak rate of composites and sealed housings is in magnitude order of 1 × 10-10 and 1 × 10-9 Pa·m3?s-1,respectively,suggesting high hermeticity.The good hermeticity is attributed to the full dense materials,good weldability,and extremely low weld porosity.The present Si/Al composites are expected to be extensively used in highly hermetic electronic packages.