Preface to the Special Issue on Beyond Moore:Three-Dimensional(3D)Heterogeneous Integration

• 作者: Yue Hao Huaqiang Wu Yuchao Yang Qi Liu Xiao Gong Genquan Han Ming Li
• 来源期刊: 半导体学报（英文版）
• 年，卷（期）: 2021,（2）
• 所属期刊栏目: EDITORIAL
• 页码范围: 16-18
• 页数: 3页
• 语种: 英文
• DOI: 10.1088/1674-4926/42/2/020101

摘要

In the past few decades,the Moore's Law has been the re-volutionary force for our integrated circuit(IC)industry.However,the tremendous challenges faced in continuous tran-sistor physical down-scaling and the unprecedented de-mands for computing and storage capabilities require our ur-gent search for strategies and solutions to integrate diverse materials,devices,circuits,and architectures in a 3D vertic-ally stacked manner so that they can orchestrate in the most effective way to provide significantly enhanced functionalit-ies as well as superior speed,energy,bandwidth,form fact,and cost.