Heat Transfer Performance of a Novel Microchannel Embedded with Connected Grooves

• 作者: Ding Yuan Wei Zhou Ting Fu Qingyu Dong
• 来源期刊: 中国机械工程学报
• 年，卷（期）: 2021,（6）
• 所属期刊栏目: Intelligent Manufacturing Technology
• 页码范围: 362-372
• 页数: 11页
• 语种: 英文

摘要

To improve the heat transfer performance of microchannels,a novel microchannel embedded with connected grooves crossing two sidewalls and the bottom surface(type A)was designed.A comparative study of heat transfer was conducted regarding the performances of type A microchannels,microchannels embedded with grooves on their bottom(including types B and C),or on the sidewalls(type D)as well as smooth rectangular microchannels(type E)via a three-dimensional numerical simulation and experimental validation(at Reynolds numbers from 118 to 430).Numerical results suggested that the average Nusselt number of types A,B,C,and D microchannels were 106,73.4,50.1,and 12.6％higher than that of type E microchannel,respectively.The smallest synergy angle β and entropy generation number Ns,a were determined for type A microchannels based on field synergy and nondimensional entropy analysis,which indicated that type A exhibited the best heat transfer performance.Numerical flow analysis indicated that connected grooves induced fluid to flow along two different temperature gradients,which contributed to enhanced heat transfer performance.