Multiscale architectures boosting thermoelectric performance of copper sulfide compound

• 作者: Xin-Qi Chen Sheng-Jie Fan Chao Han Tian Wu Lian-Jun Wang Wan Jiang Wei Dai Jian-Ping Yang
• 来源期刊: 稀有金属（英文版）
• 年，卷（期）: 2021,（8）
• 所属期刊栏目: ORIGINAL ARTICLES
• 页码范围: 2017-2025
• 页数: 9页
• 语种: 英文

摘要

Owing to their high performance and earth abundance,copper sulfides (Cu2-xS) have attracted wide attention as a promising medium-temperature thermoelec-tric material.Nanostructure and grain-boundary engineer-ing are explored to tune the electrical transport and phonon scattering of Cu2-xS based on the liquid-like copper ion.Here multiscale architecture-engineered Cu2-xS are fabri-cated by a room-temperature wet chemical synthesis combining mechanical mixing and spark plasma sintering.The observed electrical conductivity in the multiscale architecture-engineered Cu2-xS is four times as much as that of the Cu2-xS sample at 800 K,which is attributed to the potential energy filtering effect at the new grain boundaries.Moreover,the multiscale architecture in the sintered Cu2-xS increases phonon scattering and results in a reduced lattice thermal conductivity of 0.2 W·m-1·K-1 and figure of merit (zT) of 1.0 at 800 K.Such a zT value is one of the record values in copper sulfide produced by chemical synthesis.These results suggest that the intro-duction of nanostructure and formation of new interface are effective strategies for the enhancement of thermoelectric material properties.