Deposition and characterization for high-quality Ti-Ni-Cu thin films with higher Cu content

• 作者: Jun Li Xiao-Yang Yi Yu Zheng Jing Wang Hai-Zhen Wang Xiang-Long Meng Zhi-Yong Gao Yue-Hui Ma
• 来源期刊: 稀有金属（英文版）
• 年，卷（期）: 2021,（8）
• 所属期刊栏目: ORIGINAL ARTICLES
• 页码范围: 2127-2133
• 页数: 7页
• 语种: 英文

摘要

In order to attain high-quality Ti-Ni-Cu film,the surface morphologies,chemical compositions and mechanical properties of Ti-Ni-Cu thin films prepared by direct current (DC) magnetron sputtering at various pro-cesses were characterized by scanning electron microscopy(SEM),X-ray diffractometer (XRD) and tensile tests.The type of substrates,Ar pressure and sputtering power had significant effects on the quality and chemical composition of Ti-Ni-Cu thin film.Compared with Si and SiO2 slides,it was easier to obtain freestanding films by adopting glass or piezoid slide as substrates.The Ti-Ni-Cu thin film deposited at lower pressure (0.10 Pa) had a better density.The surface was featured with porous structure in the Ti-Ni-Cu thin film prepared by higher Ar pressure of 0.36 Pa.In addition,both the tensile strength and strain of annealed Ti-Ni-Cu thin film continuously increased with Ar pres-sure decreasing.Higher density contributed to the superior mechanical properties.The deposition rate firstly increased and then decreased with Ar pressure and sputtering power increasing.The composition of deposited Ti-Ni-Cu film can be tailored by changing sputter power.The deposited Ti-Ni-Cu thin films at different processing parameters were in amorphous state.In short,the present study offered the important theoretical basis for the preparation of Ti-Ni-Cu thin film with higher quality and performance.