Preparation of AIN film grown on sputter-deposited and annealed AIN buffer layer via HVPE

• 来源期刊: 中国物理B（英文版）
• 年，卷（期）: 2021,（3）
• 所属期刊栏目: CONDENSED MATTER:STRUCTURAL,MECHANICAL,AND THERMAL PROPERTIES
• 页码范围: 484-490
• 页数: 7页
• 语种: 英文
• DOI: 10.1088/1674-1056/abd392

摘要

AlN films grown on sputter-deposited and annealed AlN buffer layer by high temperature hydride vapor phase epitaxy(HVPE)have been fabricated and structurally characterized.The crystalline quality and surface morphology of as-grown AlN films with various V/III ratios were studied and compared.The XRD results showed that the crystalline quality of the AlN film could be optimized when the growth V/III ratio was 150.At the same time,the full width at half-maximum(FWHM)values of(0002)-and(1012)-plane were 64 arcsec and 648 arcsec,respectively.As revealed by AFM,the AlN films grown with higher V/III ratios of 150 and 300 exhibited apparent hillock-like surface structure due to the low density of screw threading dislocation(TD).The defects microstructure and strain field around the HVPE-AlN/sputtered-AlN/sapphire interfaces have been investigated by transmission electron microscopy(TEM)technique combined with geometric phase analysis(GPA).It was found that the screw TDs within AlN films intend to turn into loops or half-loops after originating from the AlN/sapphire interface,while the edge ones would bend first and then reacted with others within a region of 400 nm above the interface.Consequently,part of the edge TDs propagated to the surface vertically.The GPA analysis indicated that the voids extending from sapphire to HVPE-A1N layer were beneficial to relax the interfacial strain of the best quality AlN film grown with a V/III ratio of 150.