Mg2Sn-induced whisker growth on the surfaces of Mg/Sn/Mg ultrasonic-assisted soldering joints

• 作者: 操慧珺 李世钦 张英干 朱轶辰 李明雨 张志昊
• 来源期刊: 中国焊接
• 年，卷（期）: 2022,（1）
• 页码范围: 47-59
• 页数: 13页
• 语种: 英文
• DOI: 10.12073/j.cw.20211209001

摘要

In this paper, the phenomena of Mg2Sn-induced Sn whisker growth were explored on the surfaces of Mg/Sn/Mg ultrasonic-as-sisted soldering joints after aging treatment. The in-situ observation and thermal analysis confirmed that the formation and the corrosion of Mg2Sn nanoparticles were the dominant reason of Sn whisker growth. The Mg2Sn accumulation at the grain boundaries would pin the dislo-cation slip and affect the continuity of whisker growth, and the boundary angle would thus play a decisive role in the growth shape of Sn whiskers due to the pining effect of Mg2Sn. This study might be conducive to elucidating the growth behavior of Sn whiskers and provide the exploration strategy to further improve the bonding strength of Mg/Sn/Mg ultrasonic-assisted soldering joints.