As a functional material,silver was employed as the electrical contact material in automotive electronics due to the excellent conductivity.However,this material was prone to the atmospheric corrosion,resulting in the damage of structure and failure of devices.In this study,the cor-rosion behavior of conductive silver applied in printed circuit board was explored,and it was found that the strongest environmental factors (SO2 pollutants,tempera-ture and relative humidity (RH)) influenced the structural damage of material on the viewpoints of kinetics and mechanism.