Thermo-activated Dislocation Emission at the Cu/Nb Interface Revealed by Molecular Dynamics Simulations

• 来源期刊: 材料科学技术学报：英文版
• 学科: 工学
• 关键词: 分子动力学模拟 模拟接口 热激活 位错发射 Cu Nb 多层复合材料 显示
• 年，卷（期）: 2011,（8）
• 页码范围: 714-718
• 页数: 5页
• 分类号: TG111.4|TP334.7
• 语种: 英文

摘要

Nanolayered Cu-Nb composites offer a series of enhanced properties for their use in extreme conditions, e.g. high field magnets and high irradiation resistance. However, the stability of the Cu/Nb heterogeneous interface needs confirmation under various conditions. In the present work, molecular dynamics simulations were carried out to investigate the interracial behavior under various temperatures with initial stress at the interface. It is found that the interface becomes unstable at simulation temperatures higher than O00 K, resulting in the emission of dislocations and loops within one or more slip systems. The emission process is Found to be thermally-activated, i.e., the higher temperature, the shorter annealing time needed. The present study is believed to assist the experimental synthesis of the Cu-Nb multilayer nanocomposites For multiple applications.