High-Frequency Heating for Soldering in Electronics

• 作者: Vladimir L. Lanin
• 来源期刊: 电路与系统(英文)
• 学科: 医学
• 关键词: HF HEATING INDUCTOR SOLDERING Electronic MODULES
• 年，卷（期）: 2012,（3）
• 页码范围: 238-241
• 页数: 4页
• 分类号: R73

摘要

Processes of high-frequency (HF) heating are examined and its parameters for the soldering of electronic modules are optimized. The advantages of HF heating are the following: selectivity by skin-effect;high density of energy;process- ing in any environment, including vacuum or inert gas;high ecological cleanliness, improvement solder flowing by electrodynamics forces increase the quality of soldering connections. Investigation of HF electromagnetic heating has allowed to optimize heating speed in local zones of soldering connections formation and to improve their quality due to joint action of superficial effects and electromagnetic forces.