A Loop Thermosyphon Type Cooling System for High Heat Flux

• 作者: Jiwon Yeo Mizuki Hayashida Seiya Yamashita Shigeru Koyama
• 来源期刊: 电子器件冷却与温度控制期刊(英文)
• 学科: 医学
• 关键词: COOLING BOILING LOOP THERMOSYPHON Grobal WARMING Potential THERMAL Resistance
• 年，卷（期）: 2014,（4）
• 页码范围: 128-137
• 页数: 10页
• 分类号: R73

摘要

With rapid development of the semiconductor technology, more efficient cooling systems for electronic devices are needed. In this situation, in the present study, a loop thermosyphon type cooling system, which is composed mainly of a heating block, an evaporator and an air-cooled condenser, is investigated experimentally in order to evaluate the cooling performance. At first, it is examined that the optimum volume filling rate of this cooling system is approximately 40%. Next, four kinds of working fluids, R1234ze(E), R1234ze(Z), R134a and ethanol, are tested using a blasted heat transfer surface of the evaporator. In cases of R1234ze(E), R1234ze(Z), R134a and ethanol, the effective heat flux, at which the heating block surface temperature reaches 70°C, is 116 W/cm2, 106 W/cm2, 104 W/cm2 and 60 W/cm2, respectively. This result indicates that R1234ze(E) is the most suitable for the present cooling system. The minimum boiling thermal resistance of R1234ze(E) is 0.05 (cm2·K)/W around the effective heat flux of 100 W/cm2. Finally, four kinds of heat transfer surfaces of the evaporator, smooth, blasted, copper-plated and finned surfaces, are tested using R1234ze(E) as working fluid. The boiling thermal resistance of the blasted surface is the smallest among tested heat transfer surfaces up to 116 W/cm2 in effective heat flux. However, it increases drastically due to the appearance of dry-patch if the effective heat flux exceeds 116 W/cm2. On the other hand, in cases of copper-plated and finned surfaces, the dry-patch does not appear up to 150 W/cm2 in effective heat flux, and the boiling thermal resistances of those surfaces keep 0.1 (cm2·K)/W.