Electroplating: Applications in the Semiconductor Industry

• 作者: Jivaan Kishore Jhothiraman Rajesh Balachandran
• 来源期刊: 化学工程与科学期刊(英文)
• 学科: 医学
• 关键词: ELECTROPLATING COPPER Interconnects MODELING
• 年，卷（期）: 2019,（2）
• 页码范围: 239-261
• 页数: 23页
• 分类号: R73

摘要

There is a lot of research that has been done on electroplating of metals depending on the type of application. In this chapter, the importance of this technique to the semiconductor industry is discussed in detail from an experimental as well as a modeling standpoint. In particular, the effect of solution variables i.e. chloride, accelerator, suppressor on copper electrodeposition is discussed. This knowledge is applied to achieve a defect-free, bottom-up metal/copper fill that eventually, is one of the most critical processes in this billion-dollar industry.