Enhanced tensile ductility of tungsten microwires via high-density dislocations and reduced grain boundaries

• 作者: Chaoqun Dang Weitong Lin Fanling Meng Hongti Zhang Sufeng Fan Xiaocui Li Ke Cao Haokun Yang Wenzhao Zhou Zhengjie Fan Ji-jung Kai Yang Lu
• 来源期刊: 材料科学技术（英文版）
• 年，卷（期）: 2021,（36）
• 页码范围: 193-202
• 页数: 10页
• 语种: 英文

摘要

Despite being strong with many outstanding physical properties,tungsten is inherently brittle at room temperature,restricting its structural and functional applications at small scales.Here,a facile strategy has been adopted,to introduce high-density dislocations while reducing grain boundaries,through elec-tron backscatter diffraction (EBSD)-guided microfabrication of cold-drawn bulk tungsten wires.The de-signed tungsten microwire attains an ultralarge uniform tensile elongation of ～10.6％,while retains a high yield strength of ～2.4 GPa.in situ TEM tensile testing reveals that the large uniform elongation of tung-sten microwires originates from the motion of pre-existing high-density dislocations,while the subse-quent ductile fracture is attributed to crack-tip plasticity and the inhibition of grain boundary cracking.This work demonstrates the application potential of tungsten microcomponents with superior ductility and workability for micro/nanoscale mechanical,electronic,and energy systems.