Effect of surface finish metallization on interfacial bonding behavior of sintered Ag joints

• 作者: 杨帆 吴炜祯 杜建军 李明雨
• 来源期刊: 中国焊接
• 年，卷（期）: 2022,（1）
• 页码范围: 60-64
• 页数: 5页
• 语种: 英文
• DOI: 10.12073/j.cw.20211130002

摘要

In this work, the sandwich joints were joined by low temperature pressureless sintering Ag paste. The morphology and thermal behavior of Ag nanoparticle paste was characterized and analyzed. The sintered Ag joints with different metallization were prepared and tested. The joints with Ag metallization exhibited superior shear strength and interface bonding ratio. However, the joints with Cu metalliza-tion showed lowest shear strength and interface delamination. The interfacial microstructures were observed and the diffusion kinetics between Ag and Au atoms were both calculated. The excessive diffusion of Ag atoms towards the Au layer deteriorated the interface bond-ing ratio and shear strength. This work will help understand the bonding mechanism between sintered Ag and other metallization.