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电子器件冷却与温度控制期刊（英文）
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主办单位：
美国科研出版社
ISSN：
2162-6162
CN：
出版周期：
季刊
邮编：
地址：
出版文献量（篇）
64
总下载数（次）
0
总被引数（次）
0
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目录
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摘要： A thermal model has been developed to study the thermal behavior of Thermosyphon integrated Hea...
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摘要： This paper presents results of an experimental investigation carried out to determine the effec...
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摘要： In this paper the performance of a counter flow microchannel heat exchanger (CFMCHE) is numeric...
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摘要： Numerical simulations of a two-dimensional laminar forced convection flow adjacent to inclined ...
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摘要： The effect of working fluid on the start-up and thermal performance in terms of thermal resista...
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摘要： Experimental works have been conducted the objective of which was to improve mechanical propert...
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摘要： Heat transfer experiments were conducted to investigate the thermal performance of air cooling ...
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摘要： The object of the research was to study the composite received in impure nitrogen medium from s...
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摘要： In this paper, three-dimensional finite element analysis using the commercial ANSYS software is...
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10. Second Law Analysis of Forced Convective Cooling in a Channel with a Heated Wall Mounted Obstacle摘要： The present work details a numerical simulation of forced convective laminar flow in a channel ...
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摘要： We have developed a loop thermosyphon for cooling electronic devices. The cooling performance o...
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摘要： A thermal via has been used to enhance the heat transfer through the printed circuit board (PCB...
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摘要： The 45。heat spreading angle is familiar among thermal designers. This angle has been used for t...
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摘要： This work analyzes heat transfer through a wall containing triangular fins partially embedded i...
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15. Thermophotovoltaic Emitters Based on a One-Dimensional Metallic-Dielectric Multilayer Nanostructures摘要： In this paper, a one-dimensional multilayer is optimized for potential applications as thermoph...
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摘要： Passive cooling techniques are cost effective and reliable methods of cooling remote radio head...
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17. Experimental Investigation of the Fluid Dynamics of a Finned Heat Sink under Operating Conditions摘要： An experimental study has been made of the fluid dynamics performance of electronic equipment d...
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摘要： Composites were obtained in the in SiC-SiAlON and Al2O3-SiAlON system. Physical-chemical proces...
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摘要： With rapid development of the semiconductor technology, more efficient cooling systems for elec...
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摘要： The paper presents an overview of heat pipes, especially those used in different space missions...
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摘要： This paper presents the temperature dependence of in-plane thermal diffusivity and anisotropy d...
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摘要： The paper aims to give a comprehensive investigation of the two dimensional deformation of a si...
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摘要： A new simultaneous measurement method for the measurement of the three thermoelectric propertie...
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摘要： Rigorous coupled-wave analysis has been used to design a glazing for hot climates. The designed...
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摘要： By placing a sample between a heated and a cooled rod, a thermal conductivity of the sample can...
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摘要： To optimize the performance of a thermoelectric device for a specific application, the device s...
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摘要： In previous years, several high-power micro-satellites below ~100 kg have been developed for hi...
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摘要： Goal: In the process of exploitation of ceramic composites often we encounter not only high mec...
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摘要： Goal: Formulation of empiric formula, which establishes relations between major matrix paramete...
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摘要： This paper aims to model a subcooled flow boiling in a vertical stainless-steel micro-channel w...
电子器件冷却与温度控制期刊（英文）基本信息
| 刊名 | 电子器件冷却与温度控制期刊（英文） | 主编 | |
| 曾用名 | |||
| 主办单位 | 美国科研出版社 | 主管单位 | |
| 出版周期 | 季刊 | 语种 | |
| ISSN | 2162-6162 | CN | |
| 邮编 | 电子邮箱 | jectc@scirp.org | |
| 电话 | 027-867588 | 网址 | |
| 地址 | 武汉市江夏区汤逊湖北路38号光谷总部空间 |
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