Reflow Soldering

• 作者: ZhangShuocheng QiaoWeimin JingLan MaYunhai WangDan
• 来源期刊: 近代物理研究所和兰州重离子加速器实验室年报：英文版
• 学科: 工学
• 关键词: 回流焊接 CSR控制 预热 均热 回流 冷却
• 年，卷（期）: 2002,（1）
• 页码范围: 111
• 页数: 1页
• 分类号: TG442

摘要

<正> Our equipment is GT800 reflow solder. It has 16 temperature zones (not include cooling zone). The conveyor speed can be changed. Default is 80 cm/min.We have successfully soldered two DSP boards and more than 150 of varying SMB. Now, those boards are used on the CSR control and monitor. Well soldering can avoid rosin joint and short circuit. Each PCB has