A New Approach on the Active Treatment for Electroless Copper Plating on Glass

• 来源期刊: 中国化学（英文版）
• 年，卷（期）: 2003,（1）
• 页码范围: 1-3
• 页数: 3页
• 语种: 英文

摘要

A new method is described for the electroless deposition of copper onto glass. Commercially available glass slide was modified with γ-aminopropyltrimethoxysilane to form self-assembled monolayer (SAM) on it. Then it was dipped directly into PdCl2 solutlon instead of the conventional SnCl2 sensitization followed by PdCl2 activation. Experimental results showed that the Pd2+ ions from PdCl2solution were coordinated to the amino groups on the glass surfaceresulting in the formation of N-Pd complex. In an electroless copper bath containing a formaldehyde reducing agent, the N-Pd complexes were reduced to Pd0 atoms, which then acted as catalysts and initiated the deposition of copper metal. Although the copper deposition rate on SAM-modified glass was slow at the beginning, it reached to that of conventional method in about 5 min.