Self-Assembly of Micro-Parts onto Si Substrates at Liquid-Liquid Interface

• 来源期刊: 中国物理快报（英文版）
• 年，卷（期）: 2006,（1）
• 页码范围: 42-44
• 页数: 3页
• 语种: 英文

摘要

We report a new approach for the self-assembly of cuboid micro-parts onto Si substrates to construct threedimensional microstructures.To perform assembly,the Si substrates are prepared with a deep cavity array as binding sites.An aggregate composed of hundreds of uniformly aligned micro-parts is formed at the C10F18-H2O interface.The micro-parts are arranged by passing the substrate through the aggregate of micro-parts,thus the micro-parts are left on the substrate,and then the substrate is vibrated ultrasonically in the solution,making it possible for the micro-parts to fall into the cavities on the substrate.Finally the substrate is pulled out of the solution after assembly.This technique could give a high yield of up to 70%,providing a ilew method for micro-assembly.