Investigation on quenching at a high-angle Cu grain boundary on an atomic scale

• 来源期刊: 中国物理（英文版）
• 关键词: molecular dynamics solidification crystal interface
• 年，卷（期）: 2006,（3）
• 页码范围: 610-617
• 页数: 8页
• 语种: 英文

摘要

We have performed molecular dynamics simulations of structural changes due to quenching the melting inter-face at a Cu ∑5(310)/[001] symmetrical tilt grain boundary. The simulation results suggest that the grain boundary structures due to quenching are different from those due to heating up to the same temperature. The calculated atom density profiles show that the grain boundary structures can be significantly changed as they are quenched to quite low temperatures.