How to reduce the Al-texture in AlN films during film preparation

• 来源期刊: 光电子快报（英文版）
• 年，卷（期）: 2012,（5）
• 页码范围: 356-358
• 页数: 3页
• 语种: 英文
• DOI: 10.1007/s11801-012-2274-x

摘要

The preparation of aluminum nitrogen (AlN) film without Al texture is of great significance for the manufacture of highperformance surface acoustic wave (SAW) device.We research the process factors which bring Al into AlN film due to radio frequency (RF) magnetron sputtering system,and discuss how the process parameters influence the AlN thin film containing Al.In the research,it is found that the high sputtering power,the low deposition pressures and low partial pressure of Ar can lead to growing Al-texture during AlN thin film preparation,and the experiment also shows that filling the chamber with nitrogen gas can recrystallize a small amount of Al composition into AlN film during the annealing process in the high temperature environment.