Lognormal Process Software Reliability Modeling with Testing-Effort

• 作者: Shigeru Yamada Shinji Inoue
• 来源期刊: 软件工程与应用(英文)
• 学科: 工学
• 关键词: SOFTWARE RELIABILITY Growth Model LOGNORMAL PROCESS Testing-Effort Function SOFTWARE RELIABILITY Assessment Measures Goodness-of-Fit
• 年，卷（期）: 2013,（4）
• 页码范围: 8-14
• 页数: 7页
• 分类号: TP31

摘要

We propose a software reliability growth model with testing-effort based on a continuous-state space stochastic process, such as a lognormal process, and conduct its goodness-of-fit evaluation. We also discuss a parameter estimation method of our model. Then, we derive several software reliability assessment measures by the probability distribution of its solution process, and compare our model with existing continuous-state space software reliability growth models in terms of the mean square error and the Akaike’s information criterion by using actual fault count data.