Packaging multi-wavelength DFB laser array using REC technology

• 来源期刊: 中国光学快报（英文版）
• 年，卷（期）: 2013,（z2）
• 页码范围: 37-39
• 页数: 3页
• 语种: 英文
• DOI: 10.3788/COL201311.S20606

摘要

Packaging of Distributed feedback (DFB) laser array based on reconstruction-equivalent-chirp (REC) technology is a bridge from chip to system,and influences the practical process of REC chip.In this letter,DFB laser arrays of 4 channel@1 310 nm and 8 channel@1 550 nm are packaged.Experimental results show that both 4 channel@1 310 nm and 8 channel@1 550 nm have uniform wavelength spacing and average side mode suppression ratio (SMSR)＞35 dB.When I=35 mA,we get the total output power 1 mW of 4 channel@1 310 nm,and 227 μW of 8 channel@1 550 nm,respectively.The high frequency characteristic of the packaged chips is also demonstrated,and the requirements of 4× 10 G or even 8× 10 G system can be reached.we demonstrate the practical and low cost performance of REC technology and indicates its potential application in the future fiber-to-the-home (FTTH).