| 篇名 | Through-silicon-via crosstalk model and optimization design for three-dimensional integrated circuits | ||
| 来源期刊 | 中国物理B(英文版) | 学科 | |
| 关键词 | three-dimensional integrated circuits through-silicon-via crosstalk driver sizing via shielding | ||
| 年,卷(期) | 2014,(3) | 所属期刊栏目 | |
| 研究方向 | 页码范围 | 591-596 | |
| 页数 | 6页 | 分类号 | |
| 字数 | 语种 | 英文 | |
| DOI | 10.1088/1674-1056/23/3/038402 | ||