Augmenting the Heat Sink for Better Heat Dissipation

• 作者: Mohammed H. S. Al Ashry
• 来源期刊: 电路与系统(英文)
• 学科: 医学
• 关键词: CONVECTIVE HEAT Transfer: HEAT Absorbed by the Natural Air FLOW Surrounding Hot Objects FORCED CONVECTIVE HEAT Transfer: Absorption of HEAT Using FORCED Air FLOW Conductivity: Is the Ability of a System to Exchange or TRANSFER Temperature within a Body or MATERIAL through the Movement of Electrons MATERIAL That Does Not Conduct HEAT Is Considered a Nonconductor
• 年，卷（期）: 2015,（2）
• 页码范围: 21-29
• 页数: 9页
• 分类号: R73

摘要

Heat sinks were invented to absorb heat from an electronic circuit conduct, and then to dissipate or radiate this heat to the surrounding supposedly, ventilated space, at a rate equal to or faster than that of its buildup. Ventilation was not initially recognized as an essential factor to thermal dispersion. However, as electronic circuit-boards continued to heat up, circuit failure became a problem, forcing the inclusion of miniaturized high speed fans. Later, heat sinks with fins and quiet fans were incorporated in most manufactured circuits. Now heat sinks come in the form of a fan with fans made to function as fins to disperse heat. Heat sinks absorb and radiate excess heat from circuit-boards in order to prolong the circuit’s life span. The higher the thermal conductivity of the material used the more efficient and effective the heat sink is. This paper is an attempt to theoretically design a heat sink with a temperature gradient lower than that of the circuit board’s excess heat.