Electrodeposition of Gold to Conformally Fill High-Aspect-Ratio Nanometric Silicon Grating Trenches: A Comparison of Pulsed and Direct Current Protocols

• 作者: Eric E. Bennett Han Wen Houxun Miao Lei Chen Nicholas Chedid Sami Znati
• 来源期刊: 表面工程材料与先进技术期刊(英文)
• 学科: 工学
• 关键词: PULSED ELECTROPLATING Gold ELECTROPLATING High Aspect Ratio TRENCHES Gold Electrodepostion Di-rect Current Electrodeposition PULSED vs. Direct Current ELECTROPLATING Atomic LAYER Deposition Platinum Seed LAYER Silicon TRENCH Gratings TRENCH Filling GRATING Filling ALD Adhesive LAYER
• 年，卷（期）: bmgcclyxjjsqkyw_2015,（4）
• 页码范围: 207-213
• 页数: 7页
• 分类号: TN3

摘要

Filling high-aspect-ratio trenches with gold is a frequent requirement in the fabrication of X-ray optics as well as micro-electronic components and other fabrication processes. Conformal electrodeposition of gold in sub-micron-width silicon trenches with an aspect ratio greater than 35 over a grating area of several square centimeters is challenging and has not been described in the literature previously. A comparison of pulsed plating and constant current plating led to a gold electroplating protocol that reliably filled trenches for such structures.