Low bending loss waveguide opens the avenue to downsizing of 3D photonic integrated circuits

• 来源期刊: 中国科学:物理学 力学 天文学（英文版）
• 年，卷（期）: 2018,（7）
• 页码范围: 103-104
• 页数: 2页
• 语种: 英文

摘要

Photonic integrated circuits (PIC) enable efficient and flexible control of photons within a compact space, thereby revolutionizing both information technology and biological and chemical sensing. Currently, semiconductor materials including silicon, silicon nitride (SiN), and indium phosphate (InP) are still the prominent PIC platforms, which can be patterned using mature photolithographic technologies [1]. Being an intrinsically planar fabrication technology, increasing the integration density in the photolithography mainly depends on reducing the sizes of individual components.