Surface roughness modulated resistivity in copper thin films

• 来源期刊: 中国科学（物理学 力学 天文学）
• 年，卷（期）: 2018,（10）
• 页码范围: 70-77
• 页数: 8页
• 语种: 中文

摘要

The surfaces of metallic thin films are never flat.The resistivity in thin films is very different from that in bulk because of the unavoidable rough surfaces.In this study,we apply a quantum-mechanical method to study the resistivity in metallic thin films.The resulting resistivity formula for metallic thin films merely involves two parameters:bulk relaxation time and surface roughness.We use the formula to fit a large number of experimental data sets for copper thin films obtained using different growing methods.With an additional tuning parameter for calibrating the film thickness,the quantum formula can provide a universal fitting to most data with a satisfactory precision,regardless of their growing methods or data source.