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摘要:
A model is developed to simulate the processes that may cause run-away exothermic reactions in the downstream of typical deposition reactors used in semiconductor manufacturing. This process model takes into account various modes of mass and heat transport as well as chemical reactions and provides insight into the key mechanisms that trigger the uncontrolled energetic reactions and cause the formation of potentially damaging hotspots. Using the developed model, a parametric study was conducted to analyze the effects of various system and operating conditions. In particular, the effects of the gaseous reactants concentrations and incoming temperature, the extent of accumulation of deposits, and the gas flow rate, and the reactions activation energy and heat of reaction are analyzed and the location and time of hot spot formation for each case are determined. The results are useful in developing strategies for mitigating the occurrence of the damaging energetic events.
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篇名 Run-Away Energetic Reactions in the Exhaust of Deposition Reactors
来源期刊 化学工程与科学期刊(英文) 学科 医学
关键词 ENERGETIC EVENTS ENERGETIC Material Process STIMULATION Model
年,卷(期) 2019,(2) 所属期刊栏目
研究方向 页码范围 223-238
页数 16页 分类号 R73
字数 语种
DOI
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ENERGETIC
EVENTS
ENERGETIC
Material
Process
STIMULATION
Model
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引文网络交叉学科
相关学者/机构
期刊影响力
化学工程与科学期刊(英文)
季刊
2160-0392
武汉市江夏区汤逊湖北路38号光谷总部空间
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386
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0
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0
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