Characterization of a New DC-Glow Discharge Plasma Set-Up to Enhance the Electronic Circuits Performance

• 作者: A. A. Talab Ashraf Yahia M. A. Saudy M. Elsayed
• 来源期刊: 现代物理(英文)
• 学科: 工学
• 关键词: DC Glow Discharge Paschen Curve Cold Plasma Characteristics Double Electric Probe Printed Circuit Board (PCB) Properties Electronic Plasma Application
• 年，卷（期）: 2020,（7）
• 页码范围: 1044-1057
• 页数: 14页
• 分类号: TG1

摘要

The (DC-GDPAU) is a DC glow discharge plasma experiment that was designed, established, and operated in the Physics Department at Ain Shams University (Egypt). The aim of this experiment is to study and improve some properties of a printed circuit board (PCB) by exposing it to the plasma. The device consists of cylindrical discharge chamber with movable parallel circular copper electrodes (cathode and anode) fixed inside it. The distance between them is 12 cm. This plasma experiment works in a low-pressure range (0.15 - 0.70 Torr) for Ar gas with a maximum DC power supply of 200 W. The Paschen curves and electrical plasma parameters (current, volt, power, resistance) characterized to the plasma have been measured and calculated at each cm between the two electrodes. Besides, the electron temperature and ion density are obtained at different radial distances using a double Langmuir probe. The electron temperature (<em>KT_e</em>) was kept stable in range 6.58 to 10.44 eV;whereas the ion density (<em>ni</em>) was in range from 0.91 × 10¹⁰ cm^{<span style="white-space:nowrap;">&minus;</span>3} to 1.79 × 10¹⁰ cm^{<span style="white-space:nowrap;">&minus;</span>3}. A digital optical microscope (800×) was employed to draw a comparison between the pre-and after effect of exposure to plasma on the shaping of the circuit layout. The experimental results show that the electrical conductivity increased after plasma exposure, also an improvement in the adhesion force in the Cu foil surface. A significant increase in the conductivity can be directly related to the position of the sample surfaces as well as to the time of exposure. This shows the importance of the obtained results in developing the PCBs manufacturing that uses in different microelectronics devices like those onboard of space vehicles.