High-strength diffusion bonding of oxide-dispersion-strengthened tungsten and CuCrZr alloy through surface nano-activation and Cu plating

• 作者: Yuanyuan Chen Yuan Huang Fei Li Lu Han Dongguang Liu Laima Luo Zongqing Ma Yongchang Liu Zumin Wang
• 来源期刊: 材料科学技术（英文版）
• 年，卷（期）: 2021,（33）
• 页码范围: 186-194
• 页数: 9页
• 语种: 英文

摘要

Oxide-dispersion-strengthened tungsten(ODS-W)and a CuCrZr alloy were bonded by a three-step pro-cess:(i)surface nano-activation,(ii)copper plating followed by annealing,and(iii)diffusion bonding.The morphological and structural evolutions of ODS-W and the interface of the ODS-W/CuCrZr joint during these processes have been thoroughly studied by X-ray diffraction,scanning electron microscopy,en-ergy dispersive spectrometry,and high-resolution transmission electron microscopy.After surface nano-activation,a nanoporous structure of ODS-W with an average pore size of～100 nm was obtained,and the Y2O3 particles therein remained unchanged.A Cu coating was tightly bonded with the surface nano-activated ODS-W after Cu plating and annealing.An interaction layer embedded with nanosized W par-ticles was formed at the interface between ODS-W and plated Cu after the three-step process.Conse-quently,well-cohesive ODS-W/Cu and ODS-W/Y2O3/Cu interfaces were formed.The ODS-W/CuCrZr joint showed high shear strengths(up to 201 MPa)and effective bonded area ratios(＞98％).The developed three-step bonding process between ODS-W and the CuCrZr alloy provides an effective support for future plasma-facing components in nuclear fusion reactor applications.