All-SiC Fiber-Optic Sensor Based on Direct Wafer Bonding for High Temperature Pressure Sensing

• 作者: Ting LIANG Wangwang LI Cheng LEI Yongwei LI Zhiqiang LI Jijun XIONG
• 来源期刊: 光子传感器（英文版）
• 年，卷（期）: 2022,（2）
• 页码范围: 130-139
• 页数: 10页
• 语种: 英文
• DOI: 10.1007/s13320-021-0640-7

摘要

This paper presents an all-SiC fiber-optic Fabry-Perot (FP) pressure sensor based on the hydrophilic direct bonding technology for the applications in the harsh environment.The operating principle,fabrication,interface characteristics,and pressure response test of the proposed all-SiC pressure sensor are discussed.The FP cavity is formed by hermetically direct bonding of two-layer SiC wafers,including a thinned SiC diaphragm and a SiC wafer with an etched cavity.White light interference is used for the detection and demodulation of the sensor pressure signals.Experimental results demonstrate the sensing capabilities for the pressure range up to 800 kPa.The all-SiC structure without any intermediate layer can avoid the sensor failure caused by the thermal expansion coefficient mismatch and therefore has a great potential for pressure measurement in high temperature environments.