The Effect of Laser Sintering Process Parameters on Cu Nanoparticle Ink in Room Conditions

• 作者: Eerik Halonen Esa Heinonen Matti M?ntysalo
• 来源期刊: 光学与光子学期刊(英文)
• 学科: 医学
• 关键词: Nanoparticles Electrical Properties Laser Processing Microstructure SINTERING THIN FILMS
• 年，卷（期）: 2013,（4）
• 页码范围: 40-44
• 页数: 5页
• 分类号: R73

摘要

Copper is an interesting material for printed electronics inks because, for example, of its good conductivity and lower raw material price compared to silver. However, post-processing Cu inks is challenging because of non-conductive copper oxide. In this work, inkjet-printed Cu nanoparticle structures were sintered on a polyimide substrate with a continuous-wave 808-nm diode laser. Laser sintering was tested by varying the sintering parameters (optical power and scanning velocity), and the electrical resistance of the samples was measured. A minimum sheet resistance of approx.90 mΩ/□ was obtained. All tests were run in room conditions. Sintered structures were then analyzed from SEM images. Results showed that laser sintering produces good repeatability, that a scanning velocity increment positively affects the process window, and that multiple sintering cycles do not increase conductivity.