Effect of Bismuth on Intermetallic Compound Growth in Lead Free Solder/Cu Microelectronic Interconnect

• 来源期刊: 材料科学技术学报：英文版
• 学科: 工学
• 关键词: 金属间化合物 生长动力学 无铅焊锡 铜互连 微电子 IMC 生长过程 焊料合金
• 年，卷（期）: 2011,（8）
• 页码范围: 741-745
• 页数: 5页
• 分类号: TG146.23|O781
• 语种: 英文

摘要

The intermetallic compound （IMC） growth kinetics in pure Sn/Cu and Sn10 wt%Bi/Cu solder joints was studied, respectively, after they were aged at 160-210℃ for different time. It was found that the total IMC in Sn10 wt%Bi/Cu joint developed faster than it did in pure Sn/Cu solder joint, when they were aged at the same temperature. And the activation energy Qa for total IMC in Sn10 wt%Bi/Cu joint was lower than that for pure Sn/Cu interconnect. The IMC growth process was discussed. The IMC Cu6Sn5 was enhanced in compensation of reduced IMC Cu3Sn growth. The work reveals that Bi element containing in lead free solder alloys with 10 wt% can enhance IMC growth in lead free solder/Cu joint during service.